发明名称 METHOD OF FORMING INSULATING LAYER OF POROUS METAL PLATE
摘要 <p>PURPOSE:To correspond high accurate cell pitch without lowering of numerical aperture of cell by adhering a film of glass powder and dielectric powder including glass powder as pressure-sensible or thermosensible ink on a peeled substrate, and pressureconnecting the obtained dielectric layer to a porous metal plate, and transferring that dielectric layer on the surface of the porous metal plate. CONSTITUTION:A desirable coefficient of linear thermal expansion of a metal plate is 80-100X10<-7>/ deg.C. As component of the metal material, the alloy of Ni at 42 weight % - Cr at 6 weight % - Fe is used, and multiple holes are formed by etching processing to form a porous metal plate. As the dielectric material, inorganic filler such as glass powder and Al2O3 or the like is used, and acrylic resin having hot-pressure-connecting characteristic is solved in the organic solvent to compose transferring vehicle. Next, the vehicle and glass powder and the inorganic filler are kneaded to compose the transferring paste. Set-solid of the paste is performed on the peeled substrate, and is dried, and after pressure-connecting the dried transferring sheet to the porous metal plate, the transferring sheet is peeled, and the porous metal plate, in which the dielectric layer is formed, is burned in the atmospheric air to form an insulating layer on the surface of the porous metal plate.</p>
申请公布号 JPH04147535(A) 申请公布日期 1992.05.21
申请号 JP19900270610 申请日期 1990.10.11
申请人 NORITAKE CO LTD 发明人 IIJIMA MOTOI;KANI AKIRA;SAGO SUMUTO;YOKOI TATSUMASA;KAMIYA HIKONORI;ASAI HIDEYUKI;SENDA SHINJI;KIKUCHI NAOYA
分类号 B32B37/00;H01J9/02;H01J17/04;H01J17/49 主分类号 B32B37/00
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