VACUUM/ELECTROSTATIC CHUCK

摘要

PURPOSE:To flatly support a wafer with a low impressed voltage by forming an insulating thin film on an electrode for an electrostatic chuck and forming a groove whose depth is less than the thickness of the insulating thin film for a vacuum chuck. CONSTITUTION:An insulating thin film 3 is formed on an electrode 2 for an electrostatic chuck and a groove 1 whose depth is much less than the thickness of the insulating thin film 3 for a vacuum chuck is formed on the surface of the insulating thin film 3. The distance between a wafer 4 and the electrode 2 for the electrostatic chuck becomes the same as the case only the electrostatic chuck is used and enough electrostatic force is obtained with a low impressed voltage.