| 摘要 |
<p>PURPOSE:To anticipate the arrangement of pads when a function to be mounted on an LSI is decided roughly and to decide it irrespective of a chip size by a method wherein the pads for bonding use which have been arranged and installed on a semiconductor chip are arranged on grid points which have been standardized at the same pitch on the axis of ordinates and on the axis of abscissas. CONSTITUTION:Grid points which have been standardized at the same pitch P are formed virtually on respective semiconductor chips 1, 2 whose chip size is different; pads 3 are arranged and installed on the grid points along the outer circumference of the semiconductor chips 1, 2 near peripheral edge parts of the semiconductor chips. Functional blocks 5 such as CPU's (central processing units) or the like are installed at the inside region of a semiconductor chip 4; pads 6 are installed on grid points around the functional blocks 5. Since coordinates of the individual pads are situated on the normalized grid points, it is possible to easily manufacture and confirm data for the coordinates of the pads.</p> |
