| 摘要 |
<p>PURPOSE:To obtain a printed board in which a surface mounting type component can be mounted with high reliability by connecting a reflow pad to a rear wiring pattern by a connecting conductor connected to the pad and an inner wiring pattern, and a lead conductor connected to the rear pattern and the inner wiring pattern. CONSTITUTION:A printed board 10 is formed by thinly covering the inner surface of a blind hole 14 opened on the way in a direction of a rear surface with a region of a reflow pad 11 of a copper foil. The pad 11 is electrically connected to a rear wiring pattern 12 by a cuplike connecting conductor 15 electrically connected to the pad 11 and an inner wiring pattern 13 of a copper foil formed previously in the layer of a board 18, and a pipelike lead conductor 17 formed by thinly covering the inner surface of a lead hole 16 punched out of the region of the pad 11 to be opened in a direction of the front surface with the region of the pattern 12 to be connected to the pattern 12 and the pattern 13. Accordingly, even if solder 53 for soldering the terminal 31 of a surface mounting type component 30 to the pad 11 flows to the conductor 15, its amount is small.</p> |
