发明名称 WIRE FOR WIRE BONDING
摘要 PURPOSE:To produce wire bonding wire which allows improved flexural strength and uses less gold material by employing a tubular wire having hollow cross section. CONSTITUTION:Bonding wire 1 is a hollow cylindrical wire which has a hollow part 2. Since a space between a semiconductor element 3 and package wiring 4 is connected by the hollow cylindrical wire 1, strong connection is allowed even with a small quantity of gold material.
申请公布号 JPH04147636(A) 申请公布日期 1992.05.21
申请号 JP19900272776 申请日期 1990.10.11
申请人 NEC KYUSHU LTD 发明人 TAKASAKI OSAMU
分类号 H01L21/60;H01L23/49 主分类号 H01L21/60
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