| 摘要 |
<p>A solid state imaging element includes a plurality of photo detectors arranged in a two-dimensional array on a semiconductor substrate, two charge transfer circuits transferring signal charges in a vertical direction and a horizontal direction, respectively, a plurality of transfer gates controlling charge transfer from the photodetectors to one of the charge transfer circuits, a scanner controlling the switching of the transfer gates, a plurality of bus lines connecting the transfer gates with the scanner, and a bus line breakage checking means. This bus line breakage checking means includes a plurality of transistors connected with each of the bus lines in series, a test pad connected with the bus lines via the transistors and a voltage applying pad controlling the switching of the transistors. Therefore, the breakage of a bus line can be detected by a wafer test without actually operating the element, whereby time and cost required for the wafer test process and the assembly process can be reduced. <IMAGE></p> |
