| 摘要 |
<p>PURPOSE:To prevent the apparatuses such as a pincette and the like from coming into contact with a wafer when an exfoliation operation is conducted, and to perform work requiring no skill by a method wherein the wafer, which is adsorbed to a wafer adsorbing plate, is subjected to a jet stream in a solution, and the wafer is exfoliated by the force of jet stream. CONSTITUTION:The water tank 2 of a wafer-exfoliating device 1 is filled up with water, and the tip part of a jetting-out nozzle and the wafer-adsorption plate 20, to be placed on a placing plate 4, are soaked into the water L completely. Then, the wafer-adsorption plate 20, on which a wafer W is adsorbed, is placed on the placing plate 4, and an optional wafer W is brought to the center of the path of a wafer guide 6. Then, water is jetted out from the jetting nozzle 12 through the intermediary of a water-feeding tube 13, the jetted water is formed into a stream of water having a certain angle, and it strikes against the circumference of the wafer and its neighborhood. The force, working to the direction separating from the wafer-adsorption plate 20, is given to the wafer W by the stream of water, and the wafer W is exfoliated from the wafer- adsorption plate 20. The wafer W drops on a wafer guide 6 by its own weight, and it falls into a wafer housing case 11.</p> |
