发明名称 |
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MAKING SAME |
摘要 |
<p>A multilayer printed wiring board is disclosed having (a) an inner layer conductive pattern (13) on an organic insulating base material; (b) a poly(vinyl acetal)-phenolic resin coating (14) containing an amine substituted organic zirconate or titanate coupling agent; (c) a dielectric insulating layer (15); (d) a bonding composition (16) capable of being adhesion promoted for electroless metal deposition comprising a phenolic resin having at least two methylol groups and substantially free of methyl ether groups, a heat resistant aromatic or cyclic resin having functional groups capable of reacting with the methylol groups without the evolution of water; and (e) an outer conductive pattern (19), the multilayer board being capable of withstanding at least five soldering cycles of at least 255 DEG C for 2 seconds without blistering or delamination. Processes for the manufacture of the inventive multilayer boards are also disclosed.</p> |
申请公布号 |
EP0275070(B1) |
申请公布日期 |
1992.05.20 |
申请号 |
EP19880100272 |
申请日期 |
1988.01.12 |
申请人 |
AMP-AKZO CORPORATION (A DELAWARE CORP.) |
发明人 |
KOHM, THOMAS S. |
分类号 |
H05K1/03;B32B15/08;C08K5/00;H05K3/18;H05K3/38;H05K3/42;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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