发明名称 |
Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same |
摘要 |
A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.
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申请公布号 |
US5114878(A) |
申请公布日期 |
1992.05.19 |
申请号 |
US19910669189 |
申请日期 |
1991.03.13 |
申请人 |
NIPPON STEEL CORPORATION |
发明人 |
MARUYAMA, TADAKATSU;OHNO, YASUHIDE;KONDA, MASASHI;KIKUCHI, TOSIHARU;SUZUKI, YASUHIRO;UNO, TOMOHIRO;OTSUKA, HIROAKI;TANAHASHI, HIROYUKI |
分类号 |
H01L21/48;H01L21/60;H01L21/603;H01L23/485;H01L23/498 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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