| 摘要 |
PURPOSE:To produce an IC package which is very economical and allows highly accurate IC chip mounting by forming a mold forming substrate provided with an IC chip connecting projecting part by transparent resin and aligning the IC chip by visual confirmation through the substrate. CONSTITUTION:A mold forming substrate 1 made of transparent resin is provided with a connecting projecting part 2 which forms a bump. A chip 5 is aligned by visual confirmation so as to overlap the projecting part 2 on the pad 6 of the IC chip 5, and simultaneously, the chip 5 is electrically connected with the substrate to be sealed by sealing resin 10. Then, an IC package which allows highly accurate IC chip mounting alignment is economically produced. |
