| 摘要 |
<p>PURPOSE:To be able to make a diversion of existing elements since the degree of freedom in an arrangement of an electrode pad is high by a method wherein a coupling between an element for controlling and a power element or a lead is performed through a pattern wiring formed on a second insulating substrate on which the element for controlling is mounted. CONSTITUTION:An element 2 for controlling is mounted on a surface of a metallic paste substrate 7. An electrode pad 2a of the element 2 for controlling is coupled to a lead 21 through a pattern 7a formed on the metallic paste substrate 7. The electrode pad 2a is connected to the pattern 7a by a bonding wire 3 and the pattern 7a is connected to the lead 21 by a bonding wire 4. Since the electrode pad 2a is coupled to the lead 21 through the pattern 7a as described above, it is unnecessary to make correspond arrangements P1 to P12 of the electrode pad 2a to arrangements L1 to L12 of the lead 21. Further, it is possible to make a multiple layer wiring on the pattern 7a by making an insulating film exist among them. Thus, the degree of freedom of the arrangement of the pad 2a of the element for controlling is made higher.</p> |
