| 摘要 |
PURPOSE:To ensure multiple pins avoiding short-circuiting by thinly distributing connection lands to be wire-bonded to corners of an IC chip, and density distributing connection lands to be wire-bonded other than the corners of the IC chip. CONSTITUTION:A pattern of a group of connection lands 2 patterned on a printed board 1 is distributed into a rectangular shape as a whole, and the connection lands 2a wire-bonded to corners of an IC chip 3 are thinly distributed while the connection lands 2b wire-bonded to parts other than the corners of the IC chip 3 are densely distributed. Accordingly, when the group of the connection lands 2 and the IC chip 3 are connected and wired in a wire-bonding region A, wiring density of relatively long wires connected with the connection lands 2a is relatively low. As a result, there is reduced short-circuiting failure occurring at the corners in the wire-bonding region A even through the IC chip 3 of multiple pins. |
