| 摘要 |
PURPOSE:To cut down the cost by a method wherein an electric insulation substrate is formed of a resin substrate. CONSTITUTION:A mount part is provided on one surface of a glass.epoxy made-substrate 1 while a semiconductor element 4 is mounted on the mount part using a resin-made semiconductor element bonding agent 6 in low thermal expansion coefficient. A wiring pattern 5 is formed on the part excluding the mount part on the surface especially, a bonding pad is arranged around the mounting part so as to be connected to the semiconductor element 4 by a bonding wire 9. An opening part 3 is provided to insert the outer terminal of a PROM 10 thereinto outside this bonding pad. On the other hand, a metallic film is provided inside this opening part 3 to be connected to the wiring pattern 5. Besides, another opening part 3' is provided outside the opening part 3 and then another metallic film is provided inside the opening part 3' so as to insert an outer terminal 2 thereinto. Finally, a thermosetting sealing resin 7 in excellent humidity resistance and low thermal expansion coefficient is potted inside the bonding pad to be covered with a metallic cap 8.
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