| 摘要 |
PURPOSE:To automatically inspect electric characteristics of a semiconductor chip by providing auxiliary test pads in the course of a lead wire connecting the semiconductor chips. CONSTITUTION:Auxiliary test pads 10... are integrally provided in the courses of lead wires 3b.... More specifically, the shapes of those auxiliary test pads 10... are substantially the same as those of test pads 4... integrally provided at the outer lead side ends of the lead wires 3a.... Since the auxiliary test pads 10... are not provided in a line, so that lead wires 3b are disposed in two lines, i.e., in the so-called zig-zag shape by altering the position of each lead wire for ensurance of a required area. For example, electric characteristics are automatically inspected for judgement of the quality of semiconductor chips by applying the tip end of a probe to the test pads 4... of the lead wires 3a... connected to the first semiconductor chip 5a and to the auxiliary test pads 10... provided in the course of the lead wire 3b.... |
