| 摘要 |
<p>PURPOSE:To obtain an IC package which can be densely mounted on a printed board or the like by a method wherein an IC chip is mounted on a main body, a large number of lead wires are formed on the surfaces of the main body and the legs, lead terminals located at the tips Of the lead wires are attached along the side faces of the legs, and the main body and the IC chip of an insulating board are sealed up with insulating sealant. CONSTITUTION:A die pad 12 is formed on the center of an insulating board 11, and a large number of lead wirings 13 of printed wirings or the like are formed on the peripheral part of the die pad 12. The lead wirings 13 are made to extend on legs 11b, and their tips are made to serve as lead terminals 13a and attached along both the sides of each leg 11b. The main body 11a of the insulating board 11 and the IC chip 1 are sealed up with an insulating resin sealant 15. The lead terminals 13a are soldered to the correspondent wirings 17 formed on a printed board 16 with solder 18.</p> |
