| 摘要 |
Production of hermetic and non-magnetic housings for microelectronics, the body of the housing being made of ceramic and the metal through-leads being, not welded, but sealed with one of the glasses used in electronics. Several sealing configurations illustrated by figures II to V can be used. On the same housing, all the sealings can be achieved with the same configuration or with two or more of the configurations described. <IMAGE>
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