| 摘要 |
PURPOSE:To decrease dent inferiority sharply in the case of use in a printed wiring board, a multilayer printed wiring board and an electric laminated sheet by re-melting the resin of the surface and rear of a prepreg whose peripheral part is cut or the resin of the peripheral end surface thereof by heating. CONSTITUTION:As the resin of a prepreg, a phenol resin, an epoxy resin, an unsaturated polyester resin, a polyimide resin, a polybutadiene resin, a thermosetting polyphenyleneoxide resin and fluoroplastic are used alone, in a modified form or in a mixed form. The amount of the resin is pref. 40-70% by wt. of a base material on a dry wt. basis. The heating of the prepreg is different according to the kind of a resin but pref. performed at 70-130 deg. for 5-30sec by an arbitrary means such as hot air or infrared rays because a resin is hardly melted in low temp.-short time heating and resin flow at the time of lamination and molding is insufficient in high temp.-long time heating and blur or void is easy to generate. |
