| 摘要 |
PURPOSE:To enhance the cooling efficiency of chips by providing a junction having Peltier effect formed while being isolated from a semiconductor chip and an electrode which supplies DC current to this junction. CONSTITUTION:A semiconductor chip 12 is housed in an artificial resin mold package 11, for example, which is also provided with a semiconductor junction 17 having Peltier effect formed based on a mother material which comprises an inner lead section 14, an outer lead section 15 of a lead frame, a bed section 16, a semiconductor chip 12 or a bonding wire 18. DC current is supplied to the junction having Peltier effect during the performance of the semiconductor chip. Therefore, the current flows into the interface having Peltier effect where a metal or a metal compound contacts, thus causing heat absorption reaction on the junction surface and enables direct cooling of the chip inside the package. It is, therefore, possible to enhance the cooling efficiency of chips. |
