| 摘要 |
PURPOSE:To execute a burn-in operation by using a semiconductor wafer by forming the semiconductor wafer in which external connecting terminals are parallel by connected and wired to bonding pads of semiconductor elements at the peripheral part of the semiconductor wafer. CONSTITUTION:External connecting terminals 3 are formed at the peripheral part of a semiconductor wafer in parts which are not overlapped with semiconductor elements and which are empty on the semiconductor wafer; a semiconductor wafer 4 in which the terminals are parallel by connected and wired to bonding pads 2 of the semiconductor elements is formed; the external connecting terminals 3 are brought into contact with a needle 6 which protrudes from a socket 5 for wafer. In this manner, the external connecting terminals 3 are formed at the peripheral part of the semiconductor wafer and are parallelly connected and wired to the bonding pads 2 in the individual semiconductor elements and a voltage or a signal is applied to the connecting terminals 3 at the peripheral part of the wafer by using the needle 6 of the socket 5 for wafer. As a result, the signal or the like can be sent to all the semiconductor elements on the semiconductor wafer. Thereby, a burn-in operation can be executed in a wafer state. |
