发明名称 INSULATING METHOD FOR INNER SURFACE OF HOLE OF CIRCUIT BOARD
摘要 PURPOSE:To apply insulating ink in a uniform thickness to the inner surface of a hole of a circuit board by inserting a rodlike pen stuck or immersed with the ink into the hole of the board and then removing it. CONSTITUTION:When a circuit board 31 is set on a supporting base 32, a hole 23 coincides at center axial lines with a rodlike pen 34. Then, when sufficient amount of insulating ink is immersed at the end of the pen 34, a pen securing plate 33 is moved down, the end of the pen 34 is inserted into the hole 32, and then removed. Accordingly, the inner surface of the hole 23 is coated with the ink. Thus, the inner surface of the hole can be effectively coated with the ink in a uniform thickness.
申请公布号 JPH04142097(A) 申请公布日期 1992.05.15
申请号 JP19900263148 申请日期 1990.10.02
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YAMAMOTO MASAAKI;YAMAMORI KAZUYUKI;KOBAYASHI KENZO;YATABE HIROSHI
分类号 H05K3/28;H05K3/46 主分类号 H05K3/28
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