| 摘要 |
PURPOSE:To minimize a package area by constituting an electric circuit with a plurality of semiconductor chips laminated in several stages. CONSTITUTION:A chip 1 (2) is mounted on an island 4 by means of a bonding agent. A chip 2(3) is further mounted thereon in a similar manner as the chip 1. The chip 1, the chip 2, and the inner lead 1 can be interconnected with a bonding wire or the chip 1 and the chip 2 can be interconnected with the bonding wire as well. It is possible to inhibit the horizontal expansion and minimize the package area, even if the number of chips increased, by constituting an electric circuit laminated in several stages in a semiconductor device.
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