ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE

摘要

A substrate (12, 14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12, 14). The adhesive composition can be in the form of a self-supporting sheet or tape or it can be on a surface of the heat recoverable article (10). When particulate conductive filler is added to the adhesive, a conductive polymer composition can be made. Such conductive compositions are suitable for use for static dissipation in an article of the invention, or in an electrical device, e.g. a heater or a circuit protection device.