发明名称 |
ULTRASONIC TRANSDUCER STRUCTURE |
摘要 |
<p>In an ultrasonic transducer having a matrix of piezoelectric elements an L-shaped printed wiring board (6 min , 3 min ) is bonded to an array (1b) of piezoelectric elements (1). The bonding points of the L-shaped printed wiring board to respective piezoelectric elements (1) are located at edge portions of respective back electrodes (2A) of the elements. The other branch of the L-shaped printed wiring board (6 min , 3 min ) is extended vertically to the surface of the piezoelectric element matrix. A backing plate (15) is formed by molding on the back side of the piezoelectric element matrix leaving the top of the L-shaped printed wiring board protruding from the molded surface of the molded backing plate (15). To produce this structure a flexible printed wiring board (6, 3) is provided with a wiring pattern having bonding areas (34) positioned corresponding to a matrix of piezoelectric elements (1). After bonding, the printed wiring board (6, 3) is cut and bent vertically to the matrix surface to form the L-shape. The matrix of piezoelectric elements (1) may be cut out from a large-size piezoelectric element (1 min ) before the molding of the backing plate (15) or after its molding.</p> |
申请公布号 |
EP0294826(B1) |
申请公布日期 |
1992.05.13 |
申请号 |
EP19880109267 |
申请日期 |
1988.06.10 |
申请人 |
FUJITSU LIMITED |
发明人 |
KAWABE, KENJI FUJITSU LIMITED;WATANABE, KAZUHIRO FUJITSU LIMITED;NAMIKI, FUMIHIRO FUJITSU LIMITED;IIDA, ATSUO FUJITSU LIMITED;SHIMURA, TAKAKI FUJITSU LIMITED |
分类号 |
A61B8/00;B06B1/06;G01N29/04;G01N29/24;H04R17/00 |
主分类号 |
A61B8/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|