| 摘要 |
PURPOSE:To enhance wire bonding properties, to provide a high density, a low resistance as a whole electric resistance of a conductor pattern, and to manufacture a ceramic package having high reliability by forming a first conductor pattern by an ultraviolet ray resin curing method. CONSTITUTION:A first conductor pattern 1 is formed on a film 4 having flexibility by an ultraviolet ray curable resin method, and the pattern 1 is transferred to a ceramic green sheet, and the film is peeled. Then, a second conductor pattern 2 is formed of thin film paste by partly superposing 3 on the pattern 1. The sheet formed with the obtained pattern 1 and the pattern 2 is placed as a second layer 7 between an upper first layer 6 and a lower third layer 8, the three layers are thermally press-bonded, laminated as a laminate, reduced to be simultaneously baked at 1500-1600 deg.C to obtain a ceramic package. |
