| 摘要 |
<p>PURPOSE:To improve the production yield of the title component by forming the second break grooves deeper than the first break grooves so that a substrate can be split smoothly at the break grooves. CONSTITUTION:After the first break grooves 12 are formed on the surface of a substrate 2, the second break grooves 13 are formed on the rear of the substrate 20 at locations corresponding to those of the grooves 12. The grooves 13 are formed deeper than the grooves 12. After the grooves 13 are formed, electric functional elements (resistances and capacitances) are formed on the surface 3 of the substrate 20. Then the substrate 20 provided with the electric functional elements is split at the break groove sections by applying an external force to the substrate 20 from the rear 6 side. When the external force is applied, the rear 6 side receives the force in its compressive direction and the surface 3 side receives the force in its tensile direction due to a flexible planar member which bends downward. Since the deeper break grooves 13 are formed on the rear 6 side which receives the force in the compressive direction and the electric functional elements are arranged on the surface 3 side which receives the force in the tensile direction, the substrate can be split smoothly. Therefore, the yield of the chip-like components is improved.</p> |
