| 摘要 |
<p>PURPOSE:To let a big current flow without reducing a wiring area by either filling an opening hole of a green sheet with resistor paste, or by applying the inside wall with the resistor paste followed by sintering the green sheet. CONSTITUTION:A ceramic layer 1 is composed of buried resistance 2, in which a hole opened by a punch or the like on a green sheet consisting of a main material of alumina and glass and of thermoplastic resin is filled with resistance paste mainly composed of ruthenium oxide by printing or the like, or inner wall resistance 3 applied to an inner wall of a hole opened by punching, and terminal electrodes 4 consisting of Ag of the buried resistance 2 or the inner wall resistance 3. Then, a prescribed number of sheets of the ceramic layers 1 are laminated to be sintered, and buried resistance 6, inner resistance 7 and a conductor layer 8 are formed in the inside so as to make a ceramic multilayer substrate. Thereby, a sectional area of resistance is increased to let flow a big current without cutting a wiring area inspite of the increased number of resistance elements.</p> |
