发明名称 MANUFACTURE OF THICK FILM MULTILAYER BOARD
摘要 PURPOSE:To unnecessitate the alignment of a connection hole and an inner conductor, and exclude a heat press working method, by previously forming the inner conductor and the communication hole on an insulating green tape. CONSTITUTION:An insulating green tape 1 is composed of a base film 2 and a hardened insulating layer 3. Communication holes 4a are bored in the tape 1, and filled with conducting paste 5. Inner conductor 6 is formed on the layer 3 of the tape 1. A dielectric layer 7 is formed on the layer 3. Before the layer 3 is dried, it is brought into close contact with a base board 8, inserted between two parallel fixed plates and dried. The film 3 is exfoliated from the layer 3 and baked, thereby obtaining a board provided with the inner conductor 6. On the surface of the board, an outer electrode 9 is formed and an overglazed layer 10 is formed thereon.
申请公布号 JPH04139793(A) 申请公布日期 1992.05.13
申请号 JP19900262705 申请日期 1990.09.28
申请人 AISIN SEIKI CO LTD 发明人 KASUGAI HIROAKI
分类号 H05K3/46;H01L27/01 主分类号 H05K3/46
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