| 摘要 |
PURPOSE:To enable the plating thickness of a bonding pad to be equalized by a method wherein the first through hole connecting to a bonding pad and a testing circuit and the second through hole connecting to a testing pad are made conductive by a pattern in low thermal conductivity while the openings of the through holes are closed with the pattern. CONSTITUTION:The title jig is provided with a conductive pattern 9 in low thermal conductivity on a wiring board provided inside a multilayer board, a bonding pad 2 and the first through hole 4 connecting to the conductive pattern 9 connected to a testing circuit having the opening thereof on the wiring substrate closed with the conductive pattern 9 furthermore, the second through hole 5 connecting to the conductive pattern 9 connected to an electrical testing pad 7 having the opening thereof on the wiring substrate closed with the conductive pattern 9. Through these procedures, the melting down of the soldered part of a bonding pad 2 to be drawn toward the testing pad 7 by surface tension can be avoided also enabling the dispersion in the plating thickness of the bonding pad 2 to be avoided. |
