| 摘要 |
PURPOSE:To enhance the humidity resistance by the heat generation effect of a thin film resistor by a method wherein the title semiconductor package is provided with a frame mold comprising the thin film resistor encircling the intermediate part of the inner leads or the whole body of a semiconductor chip mounting part. CONSTITUTION:The title semiconductor package is provided with a frame mold 9 comprising the thin film resistor encircling the intermediate part of the inner leads 6-8 inside a lead frame or the whole body of a semiconductor chip mounting part 3. Next, the inner leads 6-8 connected to the power supply pads 4 of a semiconductor chip 1 and gland pads 5 by bonding metallic wires 11 are connected to the frame mold 9 by said wires 11. Through these procedures, the permeation of water content containing the external impurities can be avoided by the heat generation effect by the frame body 9 comprising the thin film resistor thereby enabling the humidity resistance to be enhanced.
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