| 摘要 |
PURPOSE:To reduce the size of a semiconductor device and to facilitate an electrical characteristic test for the device by a method wherein opening parts are provided in parts of a protective film covering a semiconductor circuit, a metal wiring is made to expose to form into electrodes, metal bumps are respectively connected to the electrodes and the whole body is sealed with a resin in such a way that one part of each metal bump is made to expose to the outside. CONSTITUTION:A semiconductor circuit is formed on the surface of a semiconductor substrate 1, a metal wiring 2 which is connected to this circuit is provided, the upper part of the wiring 2 is covered with a protective film 4, opening parts are provided in parts of this film 4 and the wiring 2 is made to expose to form into electrodes 3. Metal bumps 5 are respectively connected to these electrodes 3 and the bumps 5 and the whole semiconductor device are sealed with a resin 6 in such a way that one part of each of these bumps 5 is exposed to the outside. Thereby, a lead frame and fine metal wires are made unnecessary, the semiconductor device can be miniaturized and at the same time, an electrical characteristic test of the device can be easily conducted. |
