Thermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blends

摘要

This invention provides a epoxy resin composition for structual substrate of PCB comprising a triazine-modified bisphenol A epoxy resin reacted with a multi-functional epoxy resin, a brominated epoxy resin, a curing agent and a curing promoter to form a cured product with excellent thermal resistance (Tg is about 170 DEG -220 DEG C. and mostly higher than 180 DEG C.) as well as good drilling properties and good toughness. Besides, it has comparable electrical and physical properties as the commercially available FR-4 printed circuit boards.