CASE FOR HOUSING INTEGRATED MICROWAVE CIRCUITS

摘要

A case for housing integrated microwave circuits comprises a metal conductor body for carrying the integrated circuits on the upper surface thereof, the first and second dielectric substrates stacked on each other and also stacked on the upper surface of the body and having square holes for receiving the integrated circuits. The first substrate has strip line patterns for connecting signal input/output pads of the integrated circuits to each other and external signal terminals, and openings each filled with a conductive metal connected to the body. The second substrate has openings each filled with the conductive metal and electromagnetic shielding partitions between the adjacent square holes to provide isolation of a wave guide mode between the integrated circuits. The openings of both substrates are correspondingly arranged to connect the conductive metals thereof so that electromagnetic shielding is effected.