| 摘要 |
<p>PURPOSE:To reduce power consumption and to perform a high speed operation by associating light receiving and emitting elements in a package of each semiconductor chip in a semiconductor device having a plurality of semiconductor chips, opposing the elements and connecting circuits between the chips. CONSTITUTION:A plurality of light receiving and emitting elements are buried in a package 2 in which an LSI chip 1 is disposed at its center. For example, a light receiving unit is exposed on a main surface, and a light emitting unit is exposed on the rear surface. For example, if two chips to be used as CPUs are coupled by an optical element in both, the two chips are vertically opposed so that the light receiving unit and the light emitting unit of the optical element 3 of the package 2 are opposed. Several - several hundreds of packaged chips are stereoscopically opposed, and may be contained in a stereoscopic cylinder (tube). The interval of the packages is not always necessarily constant, and about 1-5cm is proper. The chip is accurately positioned by using a peripheral metal guide frame 4, and a stopper, etc., formed at the frame 4.</p> |
