| 摘要 |
PURPOSE:To accurately apply cream solder to a printed board by applying the cream solder in such a way that the solder previously put in through holes can be stuck to and carried by the leading ends of the applying pins while the solder is pushed out by the pins when the pins are passed through the through holes of a pattern mask. CONSTITUTION:As an upward/downward moving section 31 descends, applying pins 46 of a pin planting section approach a pattern mask section 61 below the pin planting section and finally pass through through holes 63 provided in a pattern mask 62. When the pins 46 pass through the holes 63, the pins 46 carry cream solder 64 previously put in the holes 63 and stuck to the leading ends of the pins 46 while the solder 64 is pushed out by the pins 46. When the section 31 further descends and the leading ends of the pins 46 reach a printed board 72 set in a printed board leadingin/setting section, the cream solder 64 adhering to the leading ends of the pins 46 can be applied in spots to the contact sections on the board 72. |
