Highly conductive polymer thick film compositions

摘要

A thermally curable conductive polymer thick film composition comprising, by weight: (a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin; (b) a second thermoplastic resin selected from the group consisting of: (i) about 1-6 parts of at least one thermoplastic polyurethane resin; (ii) about 2-10 parts of at least one thermoplastic polyurethane resin; (iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin; (c) about 0.05-1 parts of a tertiary amine; (d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and (e) about 50-80 parts of silver flake.