| 摘要 |
PURPOSE:To easily adjust distortion by adjusting the distortion of a pattern projected on a wafer from a reticle by the combination of the turning on/off of vacuume suction with respect to plural suction holes provided on a reticle stage. CONSTITUTION:The distortion of the pattern projected on the wafer 7 from the reticle 2 is adjusted by the combination of the turning on/off of the vacuume suction with respect to the plural suction holes 8 provided on the reticle stage 1. In such a way, at least four suction patterns are provided on the stage 1 and a position where the vacuum suction of the reticle 2 is executed is changed by the optional combination. Thus, the slight warpage of the reticle is corrected and the distortion is corrected in a short time by a simple means. |
