发明名称 THERMALLY CURING DEVICE
摘要 PURPOSE:To prevent substrate from being oxidized and, at the same time, the substrate and chips on the substrate from being tainted by a structure wherein a controlling means of amount of exhaust gas equipped with a Venturi tube and a manometer, which control the pressure in a thermally curing chamber to be nearly equal to atmospheric pressure, in an inert gas discharging part. CONSTITUTION:Heated inert gas having the temperature and flow rate suitable for curing conditions is introduced from a gas supplying system 3. At the same time, the flow rate of exhaust gas is controlled so as to compensate the amount of the heated inert gas introduced by measuring the flow rate of tire exhaust gas flowing in a Venturi tube 7 with a manometer 10 and regulating the opening of a flow control valve 8. Thus, the heated inert gas, which is introduced through straightening vanes 3a in a thermally curing chamber 2, is lead out through exhaust passages 5b formed between the heating blocks 5a to exhaust pipes b, resulting in regulating the pressure in the thermally curing chamber to be nearly equal to atmospheric pressure. Accordingly, the oxidation of substrate P due to the intrusion of the air is prevented from occurring. Further, since no heated inert gas, which accompanies the evaporated component of adhesive, flows on the substrate P, the substrate and especially chips on the substrate can also be prevented from being tainted.
申请公布号 JPH04135811(A) 申请公布日期 1992.05.11
申请号 JP19900259980 申请日期 1990.09.28
申请人 NIPPON SANSO KK;SHINKU RAITO:KK 发明人 KIMOTO TAKESHI
分类号 B29C35/04;B29C35/02;B29L31/34;H01L21/52 主分类号 B29C35/04
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