| 摘要 |
PURPOSE:To simplify the assembling operation of circuit board and electronic parts by sticking the part of shield material to a portion from side surface to the top surface of a protrusion. CONSTITUTION:In the resin molded object 21 with a shield layer, a part of shield material 12 is stuck to a portion from the side surface to the top surface of a protrusion 13. A pair of molds 23, 24 are used, and one mold 23 has the recessed part 25 for molding the protrusion, and the shield material is temporally fixed to the cavity surface of one mold 23. After a pair of molds 23, 24 have been closed, the cavity 26 is filled with resin, whereby the shield material 12 and a resin-molded object 11 are made integral, and a protrusion 13 is formed on the side of the shield layer. In this manufacture, one side of the edge of the recessed part 25 is molded into curved surface, and the other side thereof is molded into sharp edge, and then the tongue part 12 of the shield material 12 is pushed into the recessed part 25, thereby molding the protrusion 13. Following process may be also used. The cutter 33 capable of advancing and retreating to the recessed part 25 of one mold 23, is provided in the other mold 24, and other sides are cut except one side of the edge of the recessed part 25 of the shield martial 12 by advancing of the cutter 33, whereby the tongue piece 12a of the shield material 12 is molded. |
