发明名称 NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION
摘要 PURPOSE:To obtain a nonswelling pattern profile high in resolution by exposing the resist composition of an alkali-soluble resin, a specified acid-photogenerating agent and a cross-linking agent and developing it with an alkaline water. CONSTITUTION:This photoresist composition contains the alkali-soluble resin, the acid-photogenerating agent, and the cross-linking agent in a weight proportion of 100:0.05 - 20:1 - 50. The alkali-soluble resin, preferably, has a phenolic hydroxyl group, and it can be embodied by a novolak resin, polyvinyl phenol, poly-N-(p-hydroxyphenyl)maleimide, poly-p-hydroxyphenyl(meth)acrylamide, etc. This negative type photosensitive undergoes process series of coating, exposure, heating, and development and is used for the photoresist.
申请公布号 JPH04136941(A) 申请公布日期 1992.05.11
申请号 JP19900260156 申请日期 1990.09.28
申请人 MITSUBISHI KASEI CORP 发明人 OCHIAI TAMEICHI;TAKAHASHI NORIAKI;ISHIGURO TOMOYO;SHINOZAKI MIKA
分类号 G03F7/004;G03F7/029;G03F7/038;H01L21/027 主分类号 G03F7/004
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