发明名称 LEAD AND SOLDER PREFORM ASSEMBLY AND METHOD OF MAKING THE SAME
摘要 1295707 Welding by pressure; soldering; shearing ERIE TECHNOLOGICAL PRODUCTS Inc 7 Aug 1970 [8 Aug 1969] 38241/70 Headings B3A B3R and B3W In a method of securing a solder preform to an electrical lead a portion of solder is impacted against the lead to shape the solder and simultaneously cold weld it to the lead. A wire 5 which may have a head 4 is supported between jaws 6, 7 in alignment with a punch having two relatively slidable parts 10, 11 the outer part 10 having an opening through which solder wire 17 may be fed. Movement of the punch in the direction 15 causes the part 10 to abut the jaws 6, 7 the part 11 continuing its movement to sever a portion of solder and then to impact the severed portion agaisnt the head 4. Part of the solder may be extruded around the head 4. In an alternative arrangement the head is formed on the wire by a first stroke of the punch and the solder formed and attached in a second stroke. Solder may be fed in preformed elements to the punch rather than in wire form. Reference is made to securing solder to wires of copper, nickel, copper-coated steel, Invar (Registered Trade Mark) or Kovar (Registered Trade Mark). The subsequent soldering of the lead to an electrical component may be effected by heating in a reducing atmosphere, or with flux.
申请公布号 US3616981(A) 申请公布日期 1971.11.02
申请号 USD3616981 申请日期 1969.08.08
申请人 ERIE TECHNOLOGICAL PRODUCTS INC. 发明人 FRANCIS E. DIETEMAN;NELLO CODA
分类号 B23K3/06;B23K20/233;H01G13/00;(IPC1-7):B23K21/00 主分类号 B23K3/06
代理机构 代理人
主权项
地址