| 摘要 |
<p>PURPOSE:To obtain a semiconductor device, which can be favorably connected and is high in reliability, by a method wherein a surface mounting type semiconductor element is constituted in such a way that a plated film consisting of a material having a good solderability is formed on the tip part of each outer lead of the element. CONSTITUTION:A surface mounting type semiconductor element is constituted in such a way that a plated film consisting of a material having a good solderability is formed on the tip of each outer lead 2 of the semiconductor element. For example, a plated part 1, such as a solder or gold-plated part or the like, applied in an even thickness in such a way as to cover the tip part of an outer lead 2 of a semiconductor device main body 5 is formed. Thereby, a problem of the weak bonding strength of the outer lead to a substrate is also eliminated and as a bump of solder is formed on the tip part, the strength of the lead 2 is increased and the reliability of the lead 2 is improved. Moreover, as the whole surface of the lead 2 is adhered on the substrate, the lead 2 has a strong bonding force to a stress from any direction and moreover, as the visual inspection of the lead 2 can be also carried out easily, a reduction in a manhour can be made and a cost reduction becomes possible.</p> |
