| 摘要 |
A plurality of leads (24) and two islands (25A, 25B) are arranged on a lead frame (21) made of a conductive metal. Semiconductor chips, substrates of which have different thicknesses, are mounted on the two islands (28A, 28B), and the lead frame is bent and formed such that the chip mounting surfaces of both the islands (25A, 25B) are lower than the upper surfaces of the corresponding leads by different amounts. |
