| 摘要 |
An epoxy resin composition for sealing semiconductors, having enhanced moisture resistance reliability, comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1): BixOy(OH)p(Y<-a>) q(NO3)r.nH2O (1) wherein Y<-a> represents a residue of an oxyacid other than nitrate; a represents the ionic valence absolute value of the residue of the oxyacid; and x, y, p, q, r and n each represents a value satisfying the following: 1 </= x 1 </= y 0 </= n 0.08 x </= p </= 0.92 x @ 0.02 x </= aq </= 0.92 x @ 0 </= r </= 0.1 x @ 3 x = 2 y + p + aq + r <IMAGE> |
