| 摘要 |
PURPOSE:To increase the manufacturing yield and to make possible very accurate temperature control of a semiconductor chip, by making a thermistor assembly by fixing a thermistor on a base of material having an excellent heat conductivity, and by fixing the assembly to a carrier. CONSTITUTION:An LD chip is mounted at a position corresponding to a lens 28 in a carrier 4. And a thermistor assembly 12 for temperature control is arranged in the vicinity of the LD chip, and fixed on the carrier 4 with Pb/Sn eutectic solder having a melting point of 183 deg.C. The fixing to the carrier 4 is done after making into an assembly by fixing a thermistor 6 to a base 10, and after mounting the LD chip on the carrier 4. When a malfunction of the thermistor 6 is found after the thermistor assembly 12 and LD chip are mounted on the carrier, only the thermistor assembly 12 can be removed by heating the carrier 4 up to about 200 deg.C, for example, and by remelting only the Pb/Sn eutectic solder. |
