IC PACKAGE FOR SOLDERLESS MOUNTING,申请号JP19900253342-传众专利搜索

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发明名称	IC PACKAGE FOR SOLDERLESS MOUNTING
摘要
申请公布号	JPH04132250(A)	申请公布日期	1992.05.06
申请号	JP19900253342	申请日期	1990.09.21
申请人	NEC CORP	发明人	WADA SHINGO
分类号	H05K1/18;H01L23/50;H05K3/30	主分类号	H05K1/18
代理机构		代理人
主权项
地址

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