发明名称 CU-BASE ALLOY POWDER FOR LASER BUILD-UP WELDING
摘要 PURPOSE:To prevent the occurrence of spatter at the time of a build-up welding and to form a superior weld bead by adding race amount of effective elements and oxygen to a Cu-base build-up alloy powder used for a laser powder build-up welding. CONSTITUTION:As the Cu-base build-up alloy powder used at the time of laser powder build-up welding, an alloy, which is prepared by incorporating, as trace additive elements, 0.01-0.1% by weight, in total, of one or >=2 kinds among Al, Y, misch metal, Ti, Zr, and Hf and 0.01-0.1% oxygen into an alloy containing 10-40% Ni and 0.1-6% Si as essential components and having the balance Cu or into a Cu alloy further containing <20% Co, <20%, in total, of Mo and W, <20% Fe, <10% Cr, and <0.5% B, is used. By using this Cu- base alloy powder, the shape of a bead can be improved at the time of laser powder build-up welding and the occurrence of defects, such as underfill, incomplete fusion, pinhole, and blowhole, can be prevented.
申请公布号 JPH04131341(A) 申请公布日期 1992.05.06
申请号 JP19900253744 申请日期 1990.09.21
申请人 FUKUDA METAL FOIL & POWDER CO LTD 发明人 NAGAI SHOZO;TANAKA KANICHI;HIDAKA KENSUKE;TERAMOTO TAKAO;YAMAGUCHI EIJI
分类号 B23K26/00;B22F1/00;B23K26/34;B23K35/30;C22C9/06 主分类号 B23K26/00
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