| 摘要 |
<p>A cooling module is provided, in combination with an electronic circuit component (7) mounted on a printed circuit board (9). The cooling module includes a heat transfer body (3, 110), for conducting heat from the electronic circuit component (7) to a coolant (2) in the module, resilient biasing means (5) connected to the heat transfer body (3, 110) and serving to urge that body towards the circuit component (7), and passage means (1) for containing the coolant (2) which flows in contact with a main face of the heat transfer body (3, 110). The heat transfer body (3, 110) comprises a heat transfer plate (3) with a substantially tubular structure (110) provided thereon and projecting axially from the main face so as to extend within the resilient biasing means (5), the passage means (1) and tubular structure (110) being such that, when the module is in use, the coolant (2) flows to a major portion of the main face by way of the tubular structure (110). In this way the coolant can be made to flow in contact with a larger heat transfer surface. <IMAGE></p> |
