| 发明名称 |
THICK FILM AND THIN FILM COMPOSITE SUBSTRATE AND ELECTRONIC CIRCUIT APPARATUS USING IT |
| 摘要 |
A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising a thin film substrate including a signal wiring layer therein, a thick film substrate laminated together with the thin film substrate, and at least a part of signal wiring being formed as a signal wiring layer included in the thick film substrate.
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| 申请公布号 |
US5110664(A) |
申请公布日期 |
1992.05.05 |
| 申请号 |
US19900550553 |
申请日期 |
1990.07.10 |
| 申请人 |
HITACHI, LTD. |
发明人 |
NAKANISHI, KEIICHIROU;YAMAMOTO, MASAKAZU;YAMADA, MINORU |
| 分类号 |
H01L23/12;H01L23/538;H05K1/02;H05K1/03;H05K1/09;H05K1/16;H05K3/40;H05K3/46 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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