| 摘要 |
<p>PURPOSE:To permit a power source circuit and a grounding circuit to be low inductance circuits by providing an exposing recessed part which is over a second base material and a heat radiating plate and exposing adhesive on the plane of the exposing recessed part. CONSTITUTION:An electronic component mounting substrate 1 is provided with an electronic component mounting recessed part 13 which penetrates a first base material 1A and adhesive 3 on the base material 1A side and that forms a spot facing to the top of a heat radiating plate 2. The part of the back of the heat radiating plate 2 is exposed by a stepped hole 11B provided on a second base material 1B. On the part the stepped hole 11B of the base material 1B faces the heat radiating plate 2, an exposing recessed part 4, which is over the base material 1B and the heat radiating plate and that exposes the adhesive on the surface, is provided by spot facing processing. The back of the heat radiating plate 2, the exposing recessed part 4 and the base material 1B is coated with a continuous metal plate layer 75. A conductive layer 76 is formed on the inner wall of the recessed part 13. A power source terminal 151 and a grounding terminal 181 are provided in parallel on the conductive layer 76.</p> |
