| 摘要 |
PURPOSE:To prevent the bonding inferiority between the cut part of a wire and the bottom by force-bonding a ball to an electrode by a capillary, and then shifting the capillary in the specified direction, and further, pressing the top of the capillary against the ball to crush the wire thereby cutting it. CONSTITUTION:The top of a wire 2, which is guided out to the top of a capillary 1, is fused by an electric torch to form a ball. The ball 3 is force-bonded on the electrode pad 5 of an IC chip 4 by the capillary 1 so as to form a bottom 6. The capillary 1 is shifted in upward vertical direction a, horizontal direction b, downward vertical direction c, and horizontal direction d reverse to said horizontal direction b, and the position of the capillary l is shifted slightly in horizontal direction from the force-bonding position. The capillary 1 is shifted downward in vertical direction, and the top of the capillary 1 is pressed against the bottom 6 so as to crush out the wire 2 extended from the bottom 6 thereby cutting it, thus a bump is formed. |
